Ukuhlelwa kwefoyile yobhedu kunye nokusetyenziswa

1.Imbali yoPhuhliso lweFoil yeCopper

Imbali yeifoyile yobheduinokulandwa emva phaya kwiminyaka yoo-1930s, xa umqambi waseMelika uThomas Edison wayeyila ilungelo elilodwa lomenzi wechiza oqhubekayo wokwenziwa kwefoyile yentsimbi ecekethekileyo, eyaba ngoovulindlela bale mihla beteknoloji yefoyile yobhedu ye-electrolytic. Emva koko, iJapan yazisa kwaye yaphuhlisa obu buchwepheshe kwiminyaka yoo-1960, kwaye iChina yafumana ukuveliswa kwefoyile yobhedu ekuqaleni kweminyaka yoo-1970.

2.Ukuhlelwa kwefoyile yobhedu

Ifoyile yobheduyahlulahlulwe ikakhulu ngamacandelo amabini: ifoyile yobhedu eqengqelekisiweyo (RA) kunye nefoyile yobhedu ye-electrolytic (ED).
Ifoyile yobhedu esongiweyo:eyenziwe ngeendlela ezibonakalayo, ezinomgangatho ogudileyo, i-conductivity egqwesileyo kunye neendleko eziphezulu.

Ifoyile yobhedu ye-Electrolytic:eyenziwe nge-electrolytic deposition, enexabiso eliphantsi, kwaye yeyona mveliso iphambili kwimarike.

Phakathi kwazo, ifoyile yobhedu ye-electrolytic inokwahlulwa kwakhona ibe ziindidi ezininzi ukuhlangabezana neemfuno ezahlukeneyo zesicelo:

● Ifoyile yobhedu ye-HTE:ukumelana nobushushu obuphezulu, i-ductility ephezulu, ifanelekile kwiibhodi ze-PCB ezininzi, ezifana neeseva eziphezulu zokusebenza kunye nezixhobo ze-avionics.
Imeko: Iiseva ze-Inspur zoLwazi oluphezulu zisebenzisa i-foil yobhedu ye-HTE ukujongana nolawulo lwe-thermal kunye nemiba yengqibelelo yomqondiso kwi-computing ephezulu yokusebenza.

● ifoyile yobhedu yeRTF:Ukuphucula ukunamathela phakathi kwefoyile yobhedu kunye ne-insulating substrate, esetyenziswa ngokuqhelekileyo kwiiyunithi zokulawula iimoto ze-elektroniki.
Imeko: Inkqubo yokulawula ibhetri yeCATL isebenzisa i-RTF ye-copper foil ukuqinisekisa ukuthembeka kunye nokuzinza phantsi kweemeko ezinzima.

● ULP ifoyile yobhedu:Iprofayile ephantsi kakhulu, inciphisa ubukhulu beebhodi zePCB, ilungele iimveliso ezibhityileyo ze-elektroniki ezinjengee-smartphones.
Imeko: I-smartphone ye-smartphone ye-Xiaomi isebenzisa i-ULP foil yobhedu ukufezekisa uyilo olukhaphukhaphu kunye noluncinci.

● Ifoyile yobhedu yeHVLP:Ifoyile yobhedu ekwiprofayili ephezulu ye-ultra-low, ixatyiswe ngokukodwa yimarike ngokusebenza kwayo okugqwesileyo kokuhambisa umqondiso. Ineenzuzo zobulukhuni obuphezulu, umphezulu ogudileyo orhabaxa, uzinzo oluhle lwe-thermal, ubukhulu obufanayo, njl., ezinokunciphisa ilahleko yomqondiso kwiimveliso ze-elektroniki. Isetyenziselwa ukuhanjiswa kweebhodi zePCB ngesantya esiphezulu njengeeseva eziphezulu kunye namaziko edatha.
Ityala: Kutshanje, iSolus Advanced Materials, omnye wabanikezeli beCCL abaphambili beNvidia eMzantsi Korea, ufumene ilayisenisi yokugqibela yokuvelisa ubuninzi beNvidia kwaye uya kubonelela ngefoyile yobhedu ye-HVLP kwi-Doosan Electronics ukuze isetyenziswe kwisizukulwana esitsha se-Nvidia se-AI accelerators ukuba uNvidia uceba ukuyisungula kulo nyaka.

3.Amashishini ezicelo kunye namatyala

●Ibhodi yeSekethe eprintiweyo (PCB)
Ifoyile yobhedu, njengomaleko wokuqhuba wePCB, licandelo eliyimfuneko kwizixhobo zombane.
Imeko: Ibhodi ye-PCB esetyenziswe kwi-server yeHuawei iqulethe i-foil ephezulu yobhedu yokuchaneka ukufezekisa uyilo olunzima lwesekethe kunye nokulungiswa kwedatha ye-high-speed.

●Ibhetri yeLithium-ion
Njengomqokeleli wangoku we-electrode engalunganga, i-foil yobhedu idlala indima ebalulekileyo kwibhetri.
Imeko: Ibhetri ye-CATL ye-lithium-ion isebenzisa i-copper ye-electrolytic ephezulu, ephucula ukuxinwa kwamandla ebhetri kunye nokuhlawuliswa kunye nokukhupha ukusebenza kakuhle.

●UkuKhusela ngoMbane
Kwizixhobo zonyango koomatshini be-MRI kunye nezikhululo ezisisiseko zonxibelelwano, ifoyile yobhedu isetyenziselwa ukukhusela ukuphazamiseka kombane.
Imeko: Izixhobo ze-MRI ze-United Imaging Medical zisebenzisa i-foil yobhedu yokukhusela i-electromagnetic shielding, iqinisekisa ukucaca kunye nokuchaneka kwemifanekiso.

● Ibhodi yeSekethe eGuquguqukayo eShicileleyo
I-foil yobhedu eqengqelekayo ifanelekile kwizixhobo zombane ezigobekayo ngenxa yokuguquguquka kwayo.
Imeko: I-Xiaomi wristband isebenzisa i-PCB eguquguqukayo, apho i-foil yobhedu ibonelela ngendlela efunekayo yokuqhuba ngelixa igcina ukuguquguquka kwesixhobo.

● Ii-electronics zabathengi, iikhompyutha kunye nezixhobo ezinxulumeneyo
Ifoyile yobhedu idlala indima ephambili kwiibhodi zezixhobo ezinje ngee-smartphones kunye neelaptops.
Imeko: Uluhlu lweHuawei lweMateBook yeelaptops zisebenzisa ifoyile yobhedu eqhuba kakhulu ukuqinisekisa ukusebenza kunye nokuthembeka kwesixhobo.

●Automotive electronics Kwiimoto zanamhlanje
ifoyile yobhedu isetyenziswa kumacandelo angundoqo e-elektroniki afana neeyunithi zokulawula injini kunye neenkqubo zolawulo lwebhetri.
Imeko: Izithuthi zombane ze-Weilai zisebenzisa i-foil yobhedu ukuphucula ukutshaja kwebhetri ukusebenza kakuhle kunye nokhuseleko.

● Kwizixhobo zonxibelelwano ezifana nezikhululo zesiseko ze-5G kunye nee-routers
i-copper foil isetyenziselwa ukufikelela kwi-high-speed data transmission.
Imeko: Isixhobo sesikhululo se-Huawei se-5G sisebenzisa i-foil ye-copper ephezulu yokusebenza ukuxhasa ukuhanjiswa kwedatha ye-high-speed and processing.

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Ixesha lokuposa: Sep-05-2024