Umahluko phakathi kwe-foil yobhedu eqengqelekayo (i-RA copper foil) kunye ne-electrolytic copper foil (i-ED copper foil)

Ifoyile yobhedusisixhobo esiyimfuneko kwimveliso yebhodi yesekethe kuba inemisebenzi emininzi enjengoqhagamshelo, ukuhanjiswa, ukuchithwa kobushushu, kunye nokukhusela i-electromagnetic. Ukubaluleka kwayo kuyabonakala. Namhlanje ndiza kukuchazela malungaifoyile yobhedu esongwayo(RA) kunye Umahluko phakathiifoyile yobhedu ye-electrolytic(ED) kunye nokuhlelwa kwefoyile yobhedu ye-PCB.

 

PCB ifoyile yobhedusisixhobo sokuqhuba esisetyenziselwa ukudibanisa amacandelo e-elektroniki kwiibhodi zeesekethe. Ngokwenkqubo yokwenziwa kunye nokusebenza, ifoyile yobhedu yePCB inokwahlulwa ibe ngamacandelo amabini: ifoyile yobhedu eqengqelekisiweyo (RA) kunye nefoyile yobhedu ye-electrolytic (ED).

I-foil yobhedu ephothiweyo yenziwe ngeentsimbi ezicocekileyo zobhedu ngokuqengqeleka ngokuqhubekayo kunye nokunyanzeliswa. Inomphezulu ogudileyo, uburhabaxa obuphantsi kunye nokuhanjiswa kombane kakuhle, kwaye ilungele ukuhanjiswa komqondiso we-frequency ephezulu. Nangona kunjalo, ixabiso lefoyile yobhedu esongiweyo liphezulu kwaye uluhlu lokutyeba lulinganiselwe, luhlala luphakathi kwe-9-105 µm.

 

Ifoyile yobhedu ye-Electrolytic ifunyenwe ngokulungiswa kwe-electrolytic deposition kwipleyiti yethusi. Elinye icala ligudile kwaye elinye lirhabaxa. Icala elirhabaxa lidityaniswe kwi-substrate, ngelixa icala eligudileyo lisetyenziselwa i-electroplating okanye i-etching. Iinzuzo zefoyile yobhedu ye-electrolytic ziindleko zayo eziphantsi kunye noluhlu olubanzi lobunzima, ngokuqhelekileyo phakathi kwe-5-400 µm. Nangona kunjalo, uburhabaxa bayo bomphezulu buphezulu kwaye umbane wayo uphantsi, nto leyo eyenza ukuba ingafaneleki ukuhanjiswa komqondiso we-high-frequency.

Ukuhlelwa kwefoyile yobhedu yePCB

 

Ukongeza, ngokoburhabaxa befoyile yobhedu ye-electrolytic, inokwahlulwa ibe ziindidi zilandelayo:

 

HTE(Ubushushu obuphezulu Elongation): Ifoyile yobhedu yobude obuphezulu, isetyenziswa ikakhulu kwiibhodi zesekethe ezinomaleko amaninzi, inobushushu obuphezulu beductility kunye namandla okubopha, kwaye uburhabaxa buphakathi kwe-4-8 µm.

 

RTF(Reverse Phatha i-Foil): Ukubuyisela umva uphathe i-foil yobhedu, ngokudibanisa i-resin ethile yokugqoka kwicala eligudileyo le-copper ye-electrolytic ye-copper ukuze kuphuculwe ukusebenza kwe-adhesive kunye nokunciphisa uburhabaxa. Uburhabaxa ngokubanzi buphakathi kwe-2-4 µm.

 

ULP(Iprofayili ye-Ultra ephantsi): i-Ultra-low profile ye-copper foil, eyenziwe kusetyenziswa inkqubo ekhethekileyo ye-electrolytic, inoburhabaxa obuphantsi kakhulu kwaye ifanele ukuhanjiswa komqondiso wesantya esiphezulu. Uburhabaxa ngokubanzi buphakathi kwe-1-2 µm.

 

HVLP(I-High Velocity Low Profile): I-foil yobhedu enesantya esiphezulu esisezantsi. Ngokusekelwe kwi-ULP, iveliswa ngokunyusa isantya se-electrolysis. Inoburhabaxa obusezantsi kunye nokusebenza kakuhle kwemveliso. Uburhabaxa ngokubanzi buphakathi kwe-0.5-1 µm. .